IC package design engineers must know early in the design cycle how the package will perform and how that performance will impact the overall system. Turbo Package Analyzer?(TPA) meets this demand by automating the analysis of complex semiconductor packages like flip-chip, chip-scale package, and multiple-die system-in-package designs. TPA further enables the prediction of IC package performance and compatibility, facilitating performance trade-off analysis before a design is committed to fabrication. TPA couples with leading electronic package layout tools to accurately model package interconnect elements, such as non-orthogonal traces, vias, wire bonds and solder balls, and to take into account the non-ideal ground planes prevalent in these advanced IC package designs. Currency: USD Unit Price: Quantity: Delivery: